Comprehensive CMP process solutions

CMP (Chemical Mechanical Planarization) is a critical technology for ensuring semiconductor miniaturization, enhanced functionality, and process stability. It cannot be replaced by any single-step alternative, making it a core process in wafer fabrication.

As advanced nodes progress, the number of CMP steps continues to increase, making the durability and stability of CMP pads and conditioning disks even more crucial.

To address these needs, tesa offers comprehensive adhesive solutions for both pads and disks, and has already been integrated into the semiconductor supply chain with qualified certifications.